authors
- Yan, Jianfeng
- Zou, Guisheng
- Wu, Ai-ping
- Ren, Jialie
- Yan, Jiuchun
- Hu, Anming
- Zhou, Norman
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
Journal Articles
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Overview
status
publication date
- April 2012
has subject area
- 0204 Condensed Matter Physics (FoR)
- 0912 Materials Engineering (FoR)
- 0913 Mechanical Engineering (FoR)
- Materials (Science Metrix)
published in
- Scripta Materialia Journal