Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging Academic Article uri icon

  •  
  • Overview
  •  
  • Research
  •  
  • Identity
  •  
  • Additional Document Info
  •  
  • View All
  •  

authors

  • Yan, Jianfeng
  • Zou, Guisheng
  • Wu, Ai-ping
  • Ren, Jialie
  • Yan, Jiuchun
  • Hu, Anming
  • Zhou, Norman

publication date

  • April 2012