Technique for site-specific plan-view transmission electron microscopy of nanostructural electronic devices

This brief report demonstrates the feasibility of preparing site-specific plan-view samples of simple electronic devices and nanostructures for the transmission electron microscope (TEM). By combining the techniques of tripod angle lapping and single-sided ion milling in a different way, we are able to target specific devices for analysis in the TEM. This is essentially performed by back-angle lapping a patterned wafer that contains multiple …