publication venue for
- Sn Bumping Without Photoresist Mould and Si Dice Stacking for 3-D Packaging. 33:912-917. 2010
- A Novel Bonding Method for Ionic Wafers. 30:598-604. 2007
- Room-Temperature Microfluidics Packaging Using Sequential Plasma Activation Process. 29:448-456. 2006
- Enhanced Cu/LCP adhesion by pre-sputter cleaning prior to Cu deposition. 28:495-502. 2005
- On resonant effects in multilayer RF/microwave printed circuit board applications. 22:200-206. 1999