Sn Bumping Without Photoresist Mould and Si Dice Stacking for 3-D Packaging
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Overview
status
publication date
- November 2010
has subject area
- 0906 Electrical and Electronic Engineering (FoR)
- 0910 Manufacturing Engineering (FoR)
- Electrical & Electronic Engineering (Science Metrix)
- Networking & Telecommunications (Science Metrix)