Characterization of the bonding strength and interface current of p-Si/n-InP wafers bonded by surface activated bonding method at room temperature

Bonding between p-Si and n-InP was performed through the surface activated bonding method at room temperature. Tensile results show that the samples were visibly separated from the bonded interface, indicating a weak bonding strength. The cause of the weak bonding strength was intensively investigated. Consistent results between x-ray photoelectron spectroscopy and atomic force microscope investigations show that a weak phase of indium is …