Conference
Development of an UHV surface activated bonding machine for MEMS packaging
Abstract
An ultra high vacuum (UHV) surface activated bonding (SAB) machine has been developed for micro electro mechanical systems (MEMS) packaging at low temperature. The bonder accommodates of wafer up to 8 inches diameter. The principle features of the bonder are the automatic parallel adjustment for 8-inch wafers to a margin of error within ±1 μm and the X, Y, and θ axis alignments accuracy is ±0.5 μm. Various combinations of 3-8 inches patterned …
Authors
Howlader MMR; Okada H; Itoh T; Suga T
Volume
19
Pagination
pp. 309-320
Publication Date
December 1, 2003
Conference proceedings
Proceedings Electrochemical Society