Conference
Reliability and Microstructure of Au-Al and Au-Cu Direct Bonding Fabricated by the Surface Activated Bonding
Abstract
SAB (Surface Activated Bonding) method has been introduced as the most appropriate interconnection method for the next generation of electronic packaging because of room temperature process and other advantages. Thus it is important to study the reliability of SAB interconnection in long term life test. In this paper, SAB interconnection interface between Au and Al or Cu during high temperature thermal aging was investigated. The degradation of …
Authors
Wang Q; Xu Z; Howlader MR; Itoh T; Suga T
Pagination
pp. 915-919
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2002
DOI
10.1109/ectc.2002.1008209
Name of conference
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)