Conference
Surface activated bonding of LCP/Cu for electronic packaging
Abstract
A lamination technique for liquid crystal polymer (LCP)/Cu was developed for high speed and high performance printed circuit boards (PCB). This approach was accomplished by using a modified surface activated bonding (SAB) process to achieve enhanced adhesion and a smooth interface. Systematic investigation of peel strength of four categories of samples, namely “as bonded”, “annealed”, “Cu-deposited”, and “Cu-deposited and annealed” showed …
Authors
Howlader MMR; Suga T; Takahashi A; Saijo K; Ozawa S; Nanbu K
Volume
40
Pagination
pp. 3177-3184
Publisher
Springer Nature
Publication Date
6 2005
DOI
10.1007/s10853-005-2681-5
Conference proceedings
Journal of Materials Science
Issue
12
ISSN
0022-2461