An 8-inch Wafer Bonding Apparatus with Ultra-High Alignment Accuracy Using Surface Activated Bonding (SAB) Concept

An ultra high precision alignment and robot-controlled wafer bonding machine has been developed for the bonding of different sizes of wafers ranging up to 8 inches diameter. A bonding accuracy of ±0.5 µm has achieved through the X, Y, and 6 axis alignments. 8-inch diameter silicon wafers were successfully bonded by the surface activated bonding (SAB) process at room temperature for the first time. Preliminary investigations across the interface …