Conference
Surface Activated Bonding Method for Flexible Lamination
Abstract
A short review is given on the flexible lamination of Cu/LCP by using the modifiedsurface activated bonding (SAB)method. It includes a comprehensive investigationon the adhesion improvement and mechanism, interface quality in terms of mechanical and electrical integrity, and fine pitch patterning [5]–[7]. Ar-rf plasma cleans the LCP surface and produces dangling sites on the LCP with reduced oxygen. This LCP surface reacts with deposited Cu. …
Authors
Howlader MMR; Suga T
Pagination
pp. 271-276
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2007
DOI
10.1109/polytr.2007.4339181
Name of conference
Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics