Conference
Surface Activation Based Nanobonding Technologies for Optoelectronics Packaging
Abstract
This article discusses the potential of surface activation based nanobonding technologies. Three-strategies of the nanobonding technologies with a number of applications such as the bonding of copper nanobumps, III-V materials and ionic materials have been discussed.
Authors
Howlader MMR
Volume
1
Pagination
pp. 55-56
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
October 1, 2009
DOI
10.1109/leos.2009.5343473
Name of conference
2009 IEEE LEOS Annual Meeting Conference Proceedings