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Surface Activation Based Nanobonding Technologies...

Surface Activation Based Nanobonding Technologies for Optoelectronics Packaging

Abstract

This article discusses the potential of surface activation based nanobonding technologies. Three-strategies of the nanobonding technologies with a number of applications such as the bonding of copper nanobumps, III-V materials and ionic materials have been discussed.

Authors

Howlader MMR

Volume

1

Pagination

pp. 55-56

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Publication Date

October 1, 2009

DOI

10.1109/leos.2009.5343473

Name of conference

2009 IEEE LEOS Annual Meeting Conference Proceedings

Associated Experts

Matiar Howlader

Associate Professor, Faculty of Engineering

Labels

Fields of Research (FoR)

3403 Macromolecular and Materials Chemistry 34 Chemical Sciences

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