Conference
Micro-and Nano-Systems Integration - The Next Frontier
Abstract
Authors
Howlader MMR
Pagination
pp. 15-15
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
May 1, 2017
DOI
10.23919/ltb-3d.2017.7947411
Name of conference
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)