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Beating the Heat: Controlling Thermal Effects in...
Conference

Beating the Heat: Controlling Thermal Effects in Plasma Dispersion Tuned SOI Waveguide Devices

Abstract

Numerical solution of the semiconductor and heat flow equations is used to show that fast plasma dispersion tuning of bipolar SOI waveguide devices can be made to dominate over slower thermooptic tuning by using shallow, polysilicon-contacted n+ and p+ regions of minimum area, and placing these regions away from the waveguide rib. Experimental results for a plasma dispersion tuned Mach Zehnder interferometer switch are used to illustrate this …

Authors

Waldron PD; Panesar H; Tarr NG; Smy TJ; Jessop PE

Pagination

pp. 258-260

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Publication Date

January 1, 2006

DOI

10.1109/group4.2006.1708232

Name of conference

3rd IEEE International Conference on Group IV Photonics, 2006.

Conference proceedings

8th IEEE International Conference on Group IV Photonics

ISSN

1949-2081