Effects of void band orientation and crystallographic anisotropy on void growth and coalescence

The effects of void band orientation and crystallographic anisotropy on void growth and linkage have been investigated. 2D model materials were fabricated by laser drilling a band of holes into the gage section of sheet tensile samples using various orientation angles with respect to the tensile axis normal. Both copper and magnesium sheets have been studied in order to examine the role of crystallographic anisotropy on the void growth and linkage processes. The samples were pulled in uniaxial tension inside the chamber of an SEM, enabling a quantitative assessment of the growth and linkage processes. The void band orientation angle has a significant impact on the growth and linkage of the holes in copper. As the void band orientation angle is increased from 0° to 45°, the processes of coalescence and linkage are delayed to higher strain values. Furthermore, the mechanism of linkage changes from internal necking to one dominated by shear localization. In contrast, the void band orientation does not have a significant impact on the void growth and linkage processes in magnesium. Void growth in these materials occurs non-uniformly due to interactions between the holes and the microstructure. The heterogeneous nature of deformation in magnesium makes it difficult to apply a coalescence criterion based on the void dimensions. Furthermore, the strain at failure does not show a relationship with the void band orientation angle. Failure associated with twin and grain boundaries interrupts the plastic growth of the holes and causes rapid fracture. Therefore, the impact of the local microstructure outweighs the effects of the void band orientation angle in this material.