Conference
Microscopic material characterization using SEM topography images correlation
Abstract
A novel microscopic strain mapping technique has been developed based on the analysis of surface topography using digital image correlation (DIC) software (J. Kang et al, Journal of strain analysis for engineering design, 40(6), 559-570, 2005). The input is a series of scanning electron microscopy (SEM) images. The method uses topographic features found in these images as the input. A commercially available optical strain measurement system …
Authors
Kang J; Schmidt T; Jain M; Wilkinson DS
Volume
3
Pagination
pp. 1389-1395
Publication Date
October 31, 2006
Conference proceedings
Proceedings of the 2006 Sem Annual Conference and Exposition on Experimental and Applied Mechanics 2006