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Microscopic material characterization using SEM...
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Microscopic material characterization using SEM topography images correlation

Abstract

A novel microscopic strain mapping technique has been developed based on the analysis of surface topography using digital image correlation (DIC) software (J. Kang et al, Journal of strain analysis for engineering design, 40(6), 559-570, 2005). The input is a series of scanning electron microscopy (SEM) images. The method uses topographic features found in these images as the input. A commercially available optical strain measurement system (ARAMISĀ®) which utilizes the DIC methodology is used for this purpose. In this paper, the method has been further validated in various applications such as using slip traces in tension aluminum alloy and fatigue of magnesium alloy, as well as microstructure features in tension of steel sheet. The selection and processing of the SEM images to achieve the best possible accuracy of the strain mapping results are discussed in detail.

Authors

Kang J; Schmidt T; Jain M; Wilkinson DS

Volume

3

Pagination

pp. 1389-1395

Publication Date

October 31, 2006

Conference proceedings

Proceedings of the 2006 Sem Annual Conference and Exposition on Experimental and Applied Mechanics 2006

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