Phase field modeling of rapid resolidification of Al-Cu thin films

A binary alloy multi-order parameter phase field model is used to study rapid solidification in Al-Cu under conditions corresponding to recent dynamic transmission electron microscopy (DTEM) experiments. The phase field model’s sharp interface limit is set through a recent matched asymptotic analysis to follow the solute trapping and interface undercooling kinetics of the Continuous Growth Model (CGM). The phase field model convergence to the …