Conference
Solidification and Microstructure of Ni-Containing Al-Si-Cu Alloy
Abstract
Authors
Fang L; Ren L; Geng X; Hu H; Nie X; Tjong J
Volume
301
Publisher
IOP Publishing
Publication Date
February 15, 2018
DOI
10.1088/1757-899x/301/1/012002
Conference proceedings
IOP Conference Series Materials Science and Engineering
Issue
1
ISSN
1757-8981