Conference
Modelling of Failure Time Distributions for Interconnects Due to Stress Voiding and Electromigration
Abstract
Authors
Wolfer WG; Bartelt MC; Dike JJ; Hoyt JJ; Gleixner RJ; Nix WD
Volume
516
Pagination
pp. 147-158
Publisher
Springer Nature
Publication Date
December 1, 1998
DOI
10.1557/proc-516-147
Conference proceedings
MRS Online Proceedings Library
Issue
1
ISSN
0272-9172