Soldering and Surface Mount Technology Journal

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publication venue for

Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer. 21:4-10. 2009
Reduced temperature soldering of capacitors using Sn‐Bi plated Sn‐3.5%Ag. 19:3-8. 2007
Fluxless plasma bumping of lead‐free solders and the reliability effects of under bump metallization thickness. 17:3-9. 2005

has subject area

0914 Resources Engineering and Extractive Metallurgy (FoR)
Applied Physics (Science Metrix)