Electro-deposition of Cu studied with in situ electrochemical scanning transmission x-ray microscopy

Soft X-ray scanning transmission X-ray microscopy (STXM) was used to investigate Cu deposition onto, and stripping from a Au surface. Cu 2p spectromicroscopy was used to analyze initial and final states (ex situ processing) and follow the processes in situ. The in situ experiments were carried out using a static electrochemical cell with an electrolyte layer thickness of ∼1 μm. A new apparatus for in situ electrochemical STXM is described.