Development of high strength pure copper wires by cryogenic deformation for magnet applications

A high strength pure copper conductor was fabricated by a cryogenic drawing process at 77 K where the dynamic recovery of copper was reduced. With this method, drawn pure copper wire achieved a strength level of 580 MPa and a conductivity of more than 96% IACS at room temperature. This strength level is about 45% higher than that obtainable by an equivalent room temperature deformation of copper. The material had a strength level of 680 MPa at …