Journal article
Mapping of wafer profile to plasma processing conditions: Forward and reverse maps
Authors
Lane J; Rietman EA; Layadi N; Lee JTC
Journal
Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena, Vol. 18, No. 1, pp. 299–302
Publisher
American Vacuum Society
Publication Date
January 1, 2000
DOI
10.1116/1.591186
ISSN
2166-2746