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Feature Profile 2D and 3D Simulation with Etching,...
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Feature Profile 2D and 3D Simulation with Etching, Deposition, and Implantation Processes

Abstract

Interaction of plasmas with solid materials during materials processing involves many phenomena. In most cases, processes of etching, deposition, and implantation go on at the same time, and the final result depends on the balance between those processes. Here, the current approach and progress in feature profile simulations via FPS3D are presented. The FPS3D code provides a convenient environment for simulations of processing for any set of materials and fluxes, as well as for any surface and volume reactions. Moreover, the code can treat “recipes” with arbitrary number of steps, each step having its own set of fluxes. To properly compute effects of implantation, the code estimates penetration depths for all used gaseous species interacting with all used solid materials. We report here on the current status of FPS3D as well as on a supporting molecular dynamics code, MDSS, which is mainly used to prepare data for the input and chemistry files for FPS3D.

Authors

Moroz P; Moroz DJ

Volume

50

Pagination

pp. 61-74

Publisher

The Electrochemical Society

Publication Date

April 1, 2013

DOI

10.1149/05046.0061ecst

Conference proceedings

ECS Transactions

Issue

46

ISSN

1938-5862
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