Conference
Multilayer SIW Filter For Advanced Packaging Based On Glass Substrates
Abstract
a multilayer SIW (Substrate Integrated Waveguide) filter on glass substrates has been designed, fabricated and measured for potential utilization in advanced 3D packaging applications. Specifically, the SIW topology is chosen to use the top and bottom metal cover of the SIW cavities as the gold-to-gold bonding surfaces. The direct bonding serves as the electrical and mechanical connections at the same time. The fabricated filter operates at X …
Authors
Yang S; Xu M; Jia X; Jiang W
Volume
00
Pagination
pp. 1-3
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 23, 2020
DOI
10.1109/iws49314.2020.9359936
Name of conference
2020 IEEE MTT-S International Wireless Symposium (IWS)