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Passive components integration in CMOS technology
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Passive components integration in CMOS technology

Abstract

The present paper aims at integrating thin films as passive components in the Back End of Line of an industrial Si-based CMOS technology while keeping limited additional technological steps. TiNxOy and TixTayO thin films deposited by magnetron sputtering were respectively investigated as resistive and high-k materials dedicated to highly integrated resistors and capacitors. We report here on electrical characterizations of thin films of both …

Authors

Salimy S; Toutain S; Averty D; Challali F; Goullet A; Besland M-P; Rhallabi A; Landesman J-P; Saubat J-C; Charpentier A

Pagination

pp. 118-121

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Publication Date

September 1, 2010

DOI

10.1109/essderc.2010.5618467

Name of conference

2010 Proceedings of the European Solid State Device Research Conference

Conference proceedings

2009 Proceedings of the European Solid State Device Research Conference

ISSN

1930-8876

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