Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires

To extend the qualification domain to the biggest package size in the automotive environment at high temperature, it is necessary to improve the Au-Al bond reliability. Thus, the improvement provided by addition of Palladium as alloying elements to Au bonding wires is evaluated. In this study, the use of Au-1wt%Pdinstead of pure Au is investigated; samples are aged at 175 and 200°C. In the case of the Au-1wt%Pd wire, a Pd-rich layer was found …