The Effect of Nozzle Geometry on Pressure Drop and Heat Transfer to Free Surface Liquid Jet Arrays

Due to the current trend of miniaturization of electronic components, higher heat fluxes are encountered. Current fan cooling methods are approaching their maximum cooling capabilities leading to the investigation of liquid cooling techniques. An experimental study of the cooling capabilities of liquid water impinging jet arrays, with a view for use in the cooling of electronic chips, is presented. The 3.0 mm thick jet nozzle plate contained 45 …