Journal article
Low Temperature Bonding of Cu Metal through Sintering of Ag Nanoparticles for High Temperature Electronic Application
Authors
Zou G; Yan J; Mu F; Wu A; Ren J; Hu A; Zhou YN
Journal
The Open Surface Science Journal, Vol. 3, No. 1, pp. 70–75
Publisher
Bentham Science Publishers
Publication Date
January 1, 2011
DOI
10.2174/1876531901103010070
ISSN
1876-5319