A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process

In order to answer to industrial requirements and to withstand environment and functioning stresses, electronic components such as MEMS, passives, or actives, have to be packaged and encapsulated. However, as the heterogeneity and complexity of devices are increasing, versatile and scalable packaging technologies are very sought after. That is why, the additive manufacturing technologies is proposed and evaluated on silicon substrates [1]. In …