Conference
Subsurface junction field effect transistor (SJFET)
Abstract
A novel, bipolar compatible junction field effect transistor structure is described in this paper. The device is fabricated using a single high energy boron implant which results in a p-type channel embedded in an n-epitaxial background material. The channel is buffered from the Si/SiO2interface by a thin n-type layer which improves device reproducibility. The resulting devices exhibit controllable pinchoff voltages in the subvolt range.
Authors
Malhi SDS; Salama CAT; Donnison W; Barber HD
Pagination
pp. 787-790
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
1980
DOI
10.1109/iedm.1980.189956
Name of conference
1980 International Electron Devices Meeting