Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force

Cu bonding wire is more and more used for interconnections to integrated circuits (ICs) to reduce cost and increase performance compared to Au wire. To eliminate underpad damage for Cu wire applications, it is worthwhile to reduce the hardness of the free-air ball (FAB). Short heat affected zone (HAZ) and high HAZ breaking load are often required for advanced microelectronics packaging in order to decrease the loop height and thereby the …