Wire bonding UPH and stitch bond improvement using 20 micron diameter insulated wire with security bump

In this study, security bumps are used for strengthening the stitch bonds of two 20 micron diameter insulated Au wire bonding example processes. Bump bonding as a variant of the ball bonding process has been commonly used in the microelectronic industry to make bumps on dies that will later be flip-chip bonded. The optimized stitch bond parameters combined with the security bumps placed upon the stitch bonds substantially improve the second …