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Dose rate dependence of residual defects in device...
Conference

Dose rate dependence of residual defects in device grade Si/SiGe heterostructures formed by ion beam synthesis

Abstract

The influence of germanium ion current density on the residual defects in ion implanted Si/SiGe heterostructures is investigated. Data from [100] silicon wafers implanted with 400 keV 9/spl times/10/sup 16/ Ge/sup +//cm/sup 2/ shows that both the nature and concentration profile of residual defects below the amorphised silicon surface layer are highly sensitive to the Ge/sup +/ current density. Dose rates in the range of 7.3/spl times/10/sup …

Authors

Nejim A; Cristiano F; Knights AP; Barradas NP; Hemment PLF; Coleman PG

Volume

2

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Publication Date

January 1, 1998

DOI

10.1109/iit.1998.813761

Name of conference

1998 International Conference on Ion Implantation Technology. Proceedings (Cat. No.98EX144)