Conference
SALVO process for sub-50 nm low-V/sub T/ replacement gate CMOS with KrF lithography
Abstract
We present the SALVO CMOS process, first device data and simulation study with the following features: (1) self-aligned local channel implants for SCE reduction; (2) sub-50 nm fabrication using only current production tools; (3) replacement gate with dual-polysilicon for low V/sub T/; (4) low aspect-ratio gates with CD insensitive to lithography and etch profile variability. The first demonstration of SALVO process shows it is a viable …
Authors
Chang C-P; Vuang H-H; Baker MR; Pai CS; Klemens FP; Miner JF; Mansfield WM; Kleiman RN; Kornbllit A; Baumann FH
Pagination
pp. 53-56
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2000
DOI
10.1109/iedm.2000.904257
Name of conference
International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138)