Conference
Free-air Ball Formation and Deformability with Pd Coated Cu Wire
Abstract
Authors
Rezvani A; Mayer M; Shah A; Zhou N; Hong SJ; Moon JT
Pagination
pp. 1516-1522
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
May 1, 2011
DOI
10.1109/ectc.2011.5898711
Name of conference
2011 IEEE 61st Electronic Components and Technology Conference (ECTC)