Conference
Evaluation of Titanium Direct Bonding Mechanism
Abstract
Direct metal bonding represents an advanced joining technology that allows vertical stacking with electrical conduction and even heat dissipation. For most metals used as bonding layers, direct bonding when operating at ambient air involves metal oxides. The bonding interface saddles with a trapped oxide layer that might affect electrical conduction and even complete sealing of bonding interface. Titanium especially, because of its high …
Authors
Baudin F; Delaye V; Guedj C; Chevalier N; Mariolle D; Imbert B; Fabbri J-M; Di Cioccio L; Bréchet Y
Volume
50
Pagination
pp. 125-132
Publisher
The Electrochemical Society
Publication Date
March 15, 2013
DOI
10.1149/05007.0125ecst
Conference proceedings
ECS Transactions
Issue
7
ISSN
1938-5862