Conference
Wafer-level packaging of three-dimensional MOEMS device with lens diaphragm
Authors
Lo JF; Fang Q; Marcu L; Kim ES
Series
Proceedings IEEE Micro Electro Mechanical Systems
Pagination
pp. 506-+
Publisher
IEEE
Publication Date
January 1, 2007
ISBN-13
978-1-4244-0950-1
Name of conference
20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007)
Conference place
Kobe, JAPAN
Conference start date
January 21, 2007
Conference end date
January 25, 2007
Conference proceedings
PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, VOLS 1 AND 2
ISSN
1084-6999