Journal article
Enhanced Cu/LCP Adhesion by Pre-Sputter Cleaning Prior to Cu Deposition
Abstract
Liquid crystal polymer (LCP) and Cu thin film cleaned with radio frequency (RF) plasma in a vacuum pressure of ${\hbox {3.0}}\times{\hbox {10}}^{-3}$ Pa followed by Cu deposition on LCP were bonded at room temperature. Immediately after bonding, the samples were unloaded, heated in air, argon, nitrogen, hydrogen, and oxygen gases, and subjected to peel strength measurements before and after heating to investigate the adhesion enhancement and …
Authors
Howlader MMR; Iwashita M; Nanbu K; Saijo K; Suga T
Journal
IEEE Transactions on Advanced Packaging, Vol. 28, No. 3, pp. 495–502
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
August 1, 2005
DOI
10.1109/tadvp.2005.848522
ISSN
1521-3323