Journal article
Room temperature wafer level glass/glass bonding
Abstract
The findings of this study report the bonding of glass/glass wafers by using the surface activated bonding (SAB) method at room temperature (RT) without heating. In order to bond, the glass wafers were activated by a sequential plasma activation process, in which the wafers were cleaned with reactive ion etching (RIE) oxygen radio frequency (rf) plasma and nitrogen radical microwave (MW) plasma one after another and then contacted under …
Authors
Howlader MMR; Suehara S; Suga T
Journal
Sensors and Actuators A Physical, Vol. 127, No. 1, pp. 31–36
Publisher
Elsevier
Publication Date
2 2006
DOI
10.1016/j.sna.2005.11.003
ISSN
0924-4247