Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder

A method for room temperature bonding of lead-free solders in different environments (vacuum, N2, air) was developed to avoid the problems caused by the high melting temperature of lead-free alloys. The method is called as surface activated bonding (SAB) method. In order to understand the influence of oxidation of Sn–Ag alloy on the bonding characteristics, the surface oxides were removed by argon fast atom beam (Ar-FAB) irradiation and then …