Conference
3D Printing as a New Packaging Approach for MEMS and Electronic Devices
Abstract
In this paper we present a new approach for building specific packaging that is scalable, versatile and could be potentially cost competitive. Using polymer additive manufacturing, more commonly known as 3D printing, we set out to build customized structures and packages perfectly adapted to component dimensions and specifications. Two different 3D printing technologies, respectively called stereolithography and Fused Deposition Molding, were …
Authors
Aspar G; Goubault B; Lebaigue O; Souriau J-C; Simon G; Di Cioccio L; Bréchet Y
Pagination
pp. 1071-1079
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
May 1, 2017
DOI
10.1109/ectc.2017.119
Name of conference
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)