Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application

There has been an increasing interest in developing low temperature interconnection process using metal nanoparticles. In this study the Ag nanoparticles (NPs) for this low temperature bonding process applications were prepared based on the polyol method using polyvinylpyrrolidone (PVP) as the protecting agent. The effect of PVP on the Ag nanoparticle size, nanoparticle solution viscosity and the bondability of the Ag nanoparticle paste were …