Home
Scholarly Works
Generalized Multi-Level Line Routing for Packaging...
Conference

Generalized Multi-Level Line Routing for Packaging Design of an Urban Air Mobility Nacelle Using Dijkstra’s Algorithm and Signed Distances

Authors

Tameer D; Jalayer S; Huh J; Jun S; Kim IY

Publisher

American Institute of Aeronautics and Astronautics (AIAA)

Publication Date

January 6, 2025

DOI

10.2514/6.2025-2034

Name of conference

AIAA SCITECH 2025 Forum
View published work (Non-McMaster Users)

Contact the Experts team