Conference
Chip-Package Interaction and Crackstop Study for Cu/Ultra low-k Interconnects
Authors
Zhang X; Smith RS; Huang R; Ho PS
Editors
Ho PS; Ogawa S; Zscheck E
Series
AIP Conference Proceedings
Volume
1143
Pagination
pp. 197-+
Publisher
AMER INST PHYSICS
Publication Date
January 1, 2009
ISBN-13
978-0-7354-0680-3
Name of conference
10th International Workshop on Stress-Induced Phenomena in Metallization
Conference place
TX, Univ Texas, Austin
Conference start date
November 5, 2008
Conference end date
November 7, 2008
Conference proceedings
STRESS-INDUCED PHENOMENA IN METALLIZATION
ISSN
0094-243X