Chip-Package Interaction and Crackstop Study for Cu/Ultra low-k Interconnects
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Overview
status
publication date
published in
presented at event
Research
keywords
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Cu interconnects
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Physical Sciences
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Physics
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Physics, Applied
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Science & Technology
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chip package interaction
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crackstop
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reliability testing
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ultra low-k
Identity
International Standard Book Number (ISBN) 13
Additional Document Info
start page
end page
volume