authors
- Kolew, A
- Heilig, M
- Schneider, Maiko
- Münch, D
- Ezzat, R
- Schneider, N
- Worgull, M
Hot embossing of transparent high aspect ratio micro parts
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Overview
status
publication date
- October 2014
has subject area
- 1005 Communications Technologies (FoR)
- 1007 Nanotechnology (FoR)
- Mechanical Engineering & Transports (Science Metrix)
- Nanoscience & Nanotechnology (Science Metrix)
published in
- Microsystem Technologies Journal