Optimal Design of Pin-Fin Heatsinks for SiC Power Modules Based on Analytical Thermal Modeling and TLBO Algorithm Conferences uri icon

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authors

  • Zhou, Linke
  • Hefny, Mohamed
  • Yang, Yuhang
  • Wang, Di
  • Jones-Jackson, Samantha
  • Pietrini, Giorgio
  • Emadi, Ali

publication date

  • June 21, 2023