Conference
Null Field Preconditioner For Fast 3D Full-wave MoM Package-Board Extraction
Authors
Negi YK; Balakrishnan N; Rao SM; Gope D
Series
Electrical Design of Advanced Packaging and Systems Symposium
Pagination
pp. 89-92
Publisher
IEEE
Publication Date
January 1, 2014
Name of conference
IEEE Electrical Design Advanced Packaging Systems Symposium (EDAPS 2014)
Conference place
INDONESIA, Bangalore
Conference start date
December 14, 2014
Conference end date
December 16, 2014
Conference proceedings
2014 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING & SYSTEMS SYMPOSIUM (EDAPS)
ISSN
2151-1225