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Passive components integration in CMOS technology

Passive components integration in CMOS technology

Abstract

The present paper aims at integrating thin films as passive components in the Back End of Line of an industrial Si-based CMOS technology while keeping limited additional technological steps. TiNxOy and TixTayO thin films deposited by magnetron sputtering were respectively investigated as resistive and high-k materials dedicated to highly integrated resistors and capacitors. We report here on electrical characterizations of thin films of both materials regarding the performances criteria of the component versus thin film characteristics.

Authors

Salimy S; Toutain S; Averty D; Challali F; Goullet A; Besland M-P; Rhallabi A; Landesman J-P; Saubat J-C; Charpentier A

Pagination

pp. 118-121

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Publication Date

September 1, 2010

DOI

10.1109/essderc.2010.5618467

Name of conference

2010 Proceedings of the European Solid State Device Research Conference

Conference proceedings

2009 Proceedings of the European Solid State Device Research Conference

ISSN

1930-8876

Associated Experts

Jean-Pierre Landesman

Adjunct Professor, Faculty of Engineering

Labels

Fields of Research (FoR)

40 Engineering 4016 Materials Engineering

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