Conference
Thermal Packaging Optimization of a UAM Nacelle Using a Dynamic Acceleration Methodology
Authors
Moffatt WC; Jalayer S; Huh J; Jun S; Kim I
Publisher
American Institute of Aeronautics and Astronautics (AIAA)
Publication Date
January 23, 2023
DOI
10.2514/6.2023-2097
Name of conference
AIAA SCITECH 2023 Forum