Conference
Enhancement of an Open Compute Project (OCP) server thermal management and waste heat recovery potential via hybrid liquid-cooling
Abstract
Authors
Battaglioli S; Lebon M; Jenkins R; Summers J; Sarkinen J; Robinson AJ
Volume
00
Pagination
pp. 1-4
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 30, 2022
DOI
10.1109/therminic57263.2022.9950635
Name of conference
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)